• LY X3 BGA Rework Station

LY X3 BGA Rework Station

Three separate heating areas, upper/lower hot air and bottom IR; heating time and temperature can display on the touch screen.

Product Details

Quick Details


1       Product profile

Ly-X3 is an economical rework station with optical alignment system, and manually controlled with the integration of soldering and desoldering design; applicable to BGAs of all forms of encapsulation.


2       Features


Hot air head and mounting head integration design, direct heating after mounting without moving PCB to avoid BGA misplaced, dual-speed motor drive, hot air head moves up and down by hand.

New-style hot air and IR mixed 2 in 1 for upper head heating; temperature rises fast, which leads to the big temperature difference between BGA and others  around with no effects on them; suitable for PCB with small pitch between components.

Three separate heating areas, upper/lower hot air and bottom IR; heating time and temperature can display on the touch screen.

Large movable bottom pre-heating area, PCB clamping device can be flexibly adjusted on X/Y-axis; Reworkable Max. PCB size 550*550mm.

Powerful cross flow fan cools down the lower heating areas quickly.

Color high-resolution optical vision system with split vision, zoom in and fine-adjusting functions, aberration distinguish device included, auto-focus, software operation, 22x optical zoom, reworkable BGA size range 1.5 * 1.5 mm ~70*70mm.

Embedded industrial computer, touch screen interface, PLC control with real-time temperature profile display; both setting profile and real temperature profile can be displayed

Inbuilt vacuum pump, rotatable 60° in Φ angle, fine-adjusting mounting suction nozzle.

Upper/lower heater with 8 segments of temperature up (down) and 8 segments of constant temperature control, industrial computer can save temperature profiles without limit; can analysis profiles on the touch screen

Suction nozzle can detect mounting height automatically with pressure controllable within 10 grams.

Many sizes of alloy nozzle, easy for replacement; can locate at all angle.

Color optical vision system manually operated.

Equipped with thermocouple port, real-time temperature monitoring and analyzing functions.

3        Technical parameter

Model No: LY-X3

Max. PCB size: L550*W500mm

PCB thickness: 0.5~5mm

BGA size: 1*1~70*70mm

Min ball pitch: 0.15mm

Max. weight of BGA: 150g

Mounting accuracy: ±0.01mm

PCB locating way: Outer

Work table adjustable: forward/backward ±10mm,left/right±10mm

Temperature control way: K-type thermocouple, close loop control

Lower heater: hot air 800W

Upper heater: IR+hot air 1200W

Bottom pre-heating:     IR 3600W

Power: Single phase 220V, 50/60 Hz

Machine size: L850*W750*H630mm

Machine weight: Approx. 80KG

LY X3 BGA Rework Station

Company Profile

Shenzhen Liyang Welding Equipment Co., Ltd. was established in 1999. We are mainly focusing on BGA rework products & accessories,Game products, USB products and peripheral products. Our customers spread all over the world and we have firmly established long-term cooperation with most of them. Even in 2008, under the worst economic circumstance, we had never given up. Customer's good feedback is our continuous motivation of going forward.

We have more than 2000 kinds of items. All of these ensure fast delivery. Normally, we can delivery within 24 hours after the payment. If no stock is available, we deliver your order within three days.

We accept Paypal, Western Union, TT, and bank transfer. Paypal and Western Union are instant payment terms, which are more preferable. Customer satisfaction is our greatest fulfillment. Let's have a pleasant cooperation! Don't hesitate any more, contact us now! The future is ours.
Shenzhen Liyang Welding Equipment Co., Ltd.


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